Resistance to Solvents of Non-Hermetic Components Encapsulation Materials

This activity addresses the risks of the detrimental effects of solvents on resin encapsulation that is applied to non-hermetic packaged products (primarily non-hermetic flip chip (class Y)). Resin encapsulation is a modern approach for the latest generation of packaging techniques and state of the art Integrated Circuits (FPGAs, DACs, ADCs, etc.).

Objectives
This study shall identify or design suitable tests or test sequences to ensure that resins or encapsulation exposed to solvents does not degrade the structure, mechanical, or electrical performance of the component.

Achievements
Initially, classification of solvent & resin types, followed by the identification of suitable test types and methods to test the effects of solvents & susceptibility of resins. Identification of limitations has forced the identification of a standard test sample to which test methods have been applied. A Test flow has been created and trialled, results have shown the suitability of the test flow. Test flow is final deliverable.

Benefits
The delivered Draft Standard will be suitable for conversion into later specification for application on all non-hermetic assemblies and component but also for resin encapsulated components of the shelf. Application range can be therefore extremely wide.

Further work
Propose and issue a new standard.