UAM - GUELP

Full description

  1. GROWTH EQUIPMENTS
    Four Czochralski equipments (equipments: L, A, S, 6) adapted with control diameter, max. T 1400C, air atmosphere, pulling rate 0.1-30 mm/h, rotation rate 2-60 rpm
    Two Czochralski equipments with controlled atmosphere (equipments: C, O) and adapted with control diameter, max. T 1400C, pulling rate 0.5-30mm/h, rotation rate 5-60rpm.
    One Czochralski equipment with controlled gas flux (one equipment: 7) adapted with control diameter, max. T 1400 C, pulling rate (0.033-30mm/h, rotation rate 5-60 rpm, equipped with control diameter.
    Two Bridgman oscillatory equipments (B1, B2), 180º rotation, max. T 1200ºC, completely computerized, facilities to sealed ampoules. Growth velocity 0.1-100mm/h.
    Two Bridgman equipments with two heating zones, max. T 1200ºC
    One Vapor growth equipment, three zones, max. T 1200ºC
    One Liquid phase epitaxy equipment. Horizontal with control atmosphere (H or N gas flux), system for multilayer growth. Max. T 800ºC.
    One Films deposition equipment: sputtering. Electron gun Alcatel equipment, vacuum up to 10 -6 Torr, filament heating.

  2. SAMPLE PREPARATION
    Glove box: for sample preparation in inert atmosphere. Inert gas system mBraun GmbH.
    Cutting machines: i) two diamond disk cutting machines from South Bay Tech. (model 660), possibilities for coupling a goniometer for sample orientation; ii) one diamond wire cutting machine, from Well (model 3242; iii) three nylon wire cutting machine, from South Bay Tech.
    Polishing machines: i)four equipment developed in the laboratory , polishing quality up to ¼ microns.ii)One commercial high quality Logitech polishing machine (model PM5) optical quality.
    Sample orientation: i) 3D goniometer adapted to the diamond disk cutting machine (2 goniometers; ii) Software support for sample orientation based on X-ray Laue orientation
    Post growth treatment: furnaces for annealing, poling and heat treatment in controlled atmosphere up to 1200ºC.

  3. METHODS OF SAMPLE CHARACTERIZATION
    Microscopy facilities: Optical microscopy (Zeiss)
    Balances
    Grinding machine: Fritsch
    Differential Thermal Analysis equipment Perkin Elmer DTA 1700.

    Atomic absoption Perkin Elmer, mod.  3110
    Access to different techniques of analysis through the Inter-department Research Service, web site: http://www.uam.es/investigacion/servicios/sidi/

  4. EQUIPMENT DEVELOPMENT
    Modification online of all crystal growth equipments
    http://www.uam.es/investigacion/servicios/segainvex/

Last update: 23 January 2012

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