Full description

1. GROWTH EQUIPMENTS
   Four Czochralski equipments (equipments: L, A, S, 6) adapted with control diameter, max. T 1400C, air atmosphere, pulling rate 0.1-30 mm/h, rotation rate 2-60 rpm
   Two Czochralski equipments with controlled atmosphere (equipments: C, O) and adapted with control diameter, max. T 1400C, pulling rate 0.5-30mm/h, rotation rate 5-60rpm.
   One Czochralski equipment with controlled gas flux (one equipment: 7) adapted with control diameter, max. T 1400 C, pulling rate (0.033-30mm/h, rotation rate 5-60 rpm, equipped with control diameter.
   Two Bridgman oscillatory equipments (B1, B2), 180º rotation, max. T 1200ºC, completely computerized, facilities to sealed ampoules. Growth velocity 0.1-100mm/h.
   Two Bridgman equipments with two heating zones, max. T 1200ºC
   One Vapor growth equipment, three zones, max. T 1200ºC
   One Liquid phase epitaxy equipment. Horizontal with control atmosphere (H or N gas flux), system for multilayer growth. Max. T 800ºC.
   One Films deposition equipment: sputtering. Electron gun Alcatel equipment, vacuum up to 10 -6 Torr, filament heating.

2. SAMPLE PREPARATION
   Glove box: for sample preparation in inert atmosphere. Inert gas system mBraun GmbH.
   Cutting machines: i) two diamond disk cutting machines from South Bay Tech. (model 660), possibilities for coupling a goniometer for sample orientation; ii) one diamond wire cutting machine, from Well (model 3242; iii) three nylon wire cutting machine, from South Bay Tech.
   Polishing machines: i)four equipment developed in the laboratory , polishing quality up to ¼ microns.ii)One commercial high quality Logitech polishing machine (model PM5) optical quality.
   Sample orientation: i) 3D goniometer adapted to the diamond disk cutting machine (2 goniometers; ii) Software support for sample orientation based on X-ray Laue orientation
   Post growth treatment: furnaces for annealing, poling and heat treatment in controlled atmosphere up to 1200ºC.

3. METHODS OF SAMPLE CHARACTERIZATION
   Microscopy facilities: Optical microscopy (Zeiss)
   Balances
   Grinding machine: Fritsch
   Differential Thermal Analysis equipment Perkin Elmer DTA 1700.

   Atomic absoption Perkin Elmer, mod.  3110
   Access to different techniques of analysis through the Inter-department Research Service, web site: http://www.uam.es/investigacion/servicios/sidi/

4. EQUIPMENT DEVELOPMENT
   Modification online of all crystal growth equipments
   http://www.uam.es/investigacion/servicios/segainvex/