High Temperature Co-fired Ceramic batch tile

The current trend towards miniaturisation in the electronics and communication sectors is on the rise, creating demands for packaging solutions with increasingly complex requirements. Since possibilities for reducing the size of conventional glass-to-metal seals have been nearly exhausted, it has become necessary to develop new and innovative approaches.

Ceramic-to-metal sealing represents one such approach, offering solutions to miniaturization, cost saving, batch processing, radiofrequency (RF) applications, higher geometric accuracy and screen printing solutions. But this process still has the potential for further development.

A GSTP activity has made a breakthrough in miniaturising High Temperature Co-fired Ceramic (HTCC) packaging such as here for RF devices. The first simulation and evaluation tests showed promising results. The HTCC MHIC devices exhibited very good performance, identical to the previously used MHIC Ring & Base devices. The results represent a breakthrough in the technology maturity and application readiness of HTCC MHIC RF devices.